Co-Packaged Optics (CPO)
Here. Now. Leading the future of Co-Packaged Optics (CPO)
Learn about the latest CPO advancements
What is CPO?
Co-Packaged Optics (CPO) is an advanced heterogeneous integration of optics and silicon on a single packaged substrate that addresses next generation bandwidth, power, and cost challenges. CPO incorporates a wide range of expertise in fiber optics, digital signal processing (DSP), ASICs, and state-of-the-art packaging & test to provide disruptive system value for data center interconnects supporting both scale-out and scale-up networks.
High power DSPs are required inside pluggable optical modules today to compensate for path interconnect losses as the signal travels from the ASIC. As SerDes technology scales to 212 Gbps PAM-4 and beyond these interconnect losses will continue to increase and demand higher power DSP compensation. Linear Retimed Optics (LRO) or Linear Pluggable Optics (LPO) continue to be impacted by these interconnect losses, but attempt to remove the DSP from inside the optical module. By placing the optics next to any ASIC through a single substrate interface, CPO provides the highest level of integration, lowest path loss, and lowest power.
Benefits
Greater than 3.5x Power Consumption Savings
40% Lower Optics Cost per Bit
> 1 Tbps/mm Bandwidth Density
Advantages
Proven Execution
Shipping production CPO systems today
Highest Performance Optical Components
Best-in-class reliability
Industry Leading SerDes and Switch
Integrated with industry’s highest-density optical engines
Solutions
Broadcom’s co-packaged optics (CPO) technology is based on highly integrated Silicon Photonics and is purpose built to address the demanding needs of AI networks by providing the highest performance, lowest power and lowest cost/bit solution. Broadcom offers CPO platform solutions attached to both Broadcom Ethernet Switches and to Broadcom XPUs.
Ethernet Switch CPO
CPO for XPU Interconnect
Advanced Packaging
Broadcom’s Advanced CPO Packaging and Wafer Scale Integration Processes Enable Manufacturing at Scale.
Timeline
Press Releases
- Broadcom Announces Tomahawk® 6 – Davisson, the Industry’s First 102.4-Tbps Ethernet Switch with Co-Packaged Optics
- Broadcom Showcases Industry-Leading Quality and Reliability of Co-Packaged Optics
- Broadcom Announces Third-Generation Co-Packaged Optics (CPO) Technology with 200G/lane Capability
- Broadcom Delivers Industry’s First 51.2-Tbps Co-Packaged Optics Ethernet Switch Platform for Scalable AI Systems
- Broadcom and Tencent Partner to Accelerate Commercialization of Co-Packaged Optics Network Switch
Video
Co-Packaged Optics (CPO): Delivering Data in the World of AI
Resources
J.P. Morgan Auto/Tech Forum
View our executive presentation on CPO at the J.P. Morgan 19th Annual Tech/Auto Forum in January 2021.
Scale-up of AI/ML Clusters Using Bi-Di Optics
Learn how CPO using a bi-directional (Bi-Di) technology can lower the cost of optics and enable a more efficient way to construct scale-up networks.